Non-adhesive design panels can be bonded to absorbent substrates in two different ways, depending on the area of application.
Bonding with white glue (PVA)
Bonding and pressing with white glue of the non-adhesive design panels (NA) is suitable for absorbent substrates – such as MDF or chipboard. This processing results in a composite board which does not expand due to the rigid connection between the design sheet and the carrier board. By using a suitable balancing board, the composite panel remains flat, so that furniture fronts or seamless wall coverings can be realized.
Here you can find out everything about bonding & pressing with PVA glue.
Bonding with SIBUKLE
If you want to bond non-adhesive design panels (NA) directly to absorbent substrates – such as plasterboard or smoothed masonry – the use of our solvent-free dispersion adhesive SIBUKLE is suitable. It is applied to the substrate with a trowel and the design panels are bonded, taking into account an expansion joint.
Here you can find out everything about bonding with SIBUKLE.